{"id":1664,"date":"2010-05-18T11:12:00","date_gmt":"2010-05-18T11:12:00","guid":{"rendered":"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/seminario-de-imaps-beyond-solder"},"modified":"2016-03-01T15:59:42","modified_gmt":"2016-03-01T15:59:42","slug":"seminario-de-imaps-beyond-solder","status":"publish","type":"post","link":"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/seminario-de-imaps-beyond-solder\/","title":{"rendered":"Seminario de IMAPS: Beyond Solder"},"content":{"rendered":"<p>IMAPS (International Microelectronics And Packaging Society) en el Reino Unido ha hecho p\u00fablicos los detalles del programa de su pr\u00f3ximo Seminario T\u00e9cnico \u00abBeyond Solder\u00bb (m\u00e1s all\u00e1 de la soldadura), que se celebrar\u00e1 en el Laboratorio Nacional de F\u00edsica, en Londres, el 30 de junio de 2010. <\/p>\n<p>Con su tema de la interconexi\u00f3n de procesos, tecnolog\u00eda y materiales, el evento ha atra\u00eddo a representantes destacados de empresas e instituciones como IeMRC, Henkel, TWI, Kulicke &#038; Soffa, Panda Europa, NPL y Irisys. <\/p>\n<p>El seminario de un d\u00eda se compone de siete presentaciones t\u00e9cnicas: \u00abJoining &#038; Packaging Technology for High Temperature Electronics\u00bb (tecnolog\u00edas de uni\u00f3n y envoltorio para dispositivos electr\u00f3nicos a alta temperatura), \u00abUltrasonically Bonded Copper Interconnects\u00bb (interconexiones de cobre unidas por ultrasonidos), \u00abPress-fit Connections For High Reliability &#038; Automotive Applications\u00bb (conexiones Press-fit para aplicaciones automotrices y de gran fiabilidad), \u00abEnd-Of-Life Options For Electronic Interconnects\u00bb (opciones al final de la vida \u00fatil de las interconexiones electr\u00f3nicas), \u00bb Innovative Adhesive Technologies\u00bb(tecnolog\u00edas adhesivas innovadoras), \u00abBonding With Nanotechnology\u00bb (uniones con nanotecnolog\u00eda) y una presentaci\u00f3n del leMRC, que trata sobre los beneficios, los retos y las oportunidades de las conexiones sin soldaduras (\u00abThe Benefits, Challenges &#038; Opportunities For Solder-free Connections\u00bb). <\/p>\n<p>El evento est\u00e1 abierto a todo el mundo, incluidos los que no sean miembros del IMAPS-Reino Unido; sin embargo, debido al enorme inter\u00e9s que ha despertado el evento, las plazas disponibles se cubrir\u00e1n por orden de llegada. Se pueden consultar m\u00e1s detalles visitando el sitio web de IMAPS-Reino Unido www.imaps.org.uk o enviando un correo electr\u00f3nico al coordinador del evento: events@imaps.org.uk  <\/p>\n<p>Fuente: <a href=\"http:\/\/www.emsnow.com\/npps\/story.cfm?pg=story&#038;id=42408\">EMSNow<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>IMAPS (International Microelectronics And Packaging Society) en el Reino Unido ha hecho p\u00fablicos los detalles del programa de su pr\u00f3ximo Seminario T\u00e9cnico \u00abBeyond Solder\u00bb (m\u00e1s all\u00e1 de la soldadura), que se celebrar\u00e1 en el Laboratorio Nacional de F\u00edsica, en Londres, el 30 de junio de 2010. Con su tema de la interconexi\u00f3n de procesos, tecnolog\u00eda y materiales, el evento ha atra\u00eddo a representantes destacados de empresas e instituciones como IeMRC, Henkel, TWI, Kulicke &#038; Soffa, Panda Europa, NPL y Irisys. El seminario de un d\u00eda se compone de siete presentaciones t\u00e9cnicas: \u00abJoining &#038; Packaging Technology for High Temperature Electronics\u00bb (tecnolog\u00edas <\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-1664","post","type-post","status-publish","format-standard","hentry","category-general"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Seminario de IMAPS: Beyond Solder - Nanotecnolog\u00eda<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/seminario-de-imaps-beyond-solder\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Seminario de IMAPS: Beyond Solder - Nanotecnolog\u00eda\" \/>\n<meta property=\"og:description\" content=\"IMAPS (International Microelectronics And Packaging Society) en el Reino Unido ha hecho p\u00fablicos los detalles del programa de su pr\u00f3ximo Seminario T\u00e9cnico \u00abBeyond Solder\u00bb (m\u00e1s all\u00e1 de la soldadura), que se celebrar\u00e1 en el Laboratorio Nacional de F\u00edsica, en Londres, el 30 de junio de 2010. 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