{"version":"1.0","provider_name":"Nanotecnolog\u00eda","provider_url":"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia","author_name":"Euroresidentes","author_url":"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/author\/euroresidentes\/","title":"Seminario de IMAPS: Beyond Solder - Nanotecnolog\u00eda","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"eXQ336SUeB\"><a href=\"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/seminario-de-imaps-beyond-solder\/\">Seminario de IMAPS: Beyond Solder<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.euroresidentes.com\/tecnologia\/nanotecnologia\/seminario-de-imaps-beyond-solder\/embed\/#?secret=eXQ336SUeB\" width=\"600\" height=\"338\" title=\"\u00abSeminario de IMAPS: Beyond Solder\u00bb \u2014 Nanotecnolog\u00eda\" data-secret=\"eXQ336SUeB\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","description":"IMAPS (International Microelectronics And Packaging Society) en el Reino Unido ha hecho p\u00fablicos los detalles del programa de su pr\u00f3ximo Seminario T\u00e9cnico \u00abBeyond Solder\u00bb (m\u00e1s all\u00e1 de la soldadura), que se celebrar\u00e1 en el Laboratorio Nacional de F\u00edsica, en Londres, el 30 de junio de 2010. Con su tema de la interconexi\u00f3n de procesos, tecnolog\u00eda y materiales, el evento ha atra\u00eddo a representantes destacados de empresas e instituciones como IeMRC, Henkel, TWI, Kulicke &#038; Soffa, Panda Europa, NPL y Irisys. El seminario de un d\u00eda se compone de siete presentaciones t\u00e9cnicas: \u00abJoining &#038; Packaging Technology for High Temperature Electronics\u00bb (tecnolog\u00edas"}